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80SQ045N
Preferred Device
Axial Lead Rectifier
These devices employ the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low-voltage, high-frequency inverters, free wheeling diodes, and polarity protection diodes.
Features
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* * * * * * * *
High Current Capability Low Stored Charge, Majority Carrier Conduction Low Power Loss/High Efficiency Highly Stable Oxide Passivated Junction Guard-Ring for Stress Protection Low Forward Voltage High Surge Capacity These are Pb-Free Devices*
SCHOTTKY BARRIER RECTIFIER 8.0 AMPERES
Mechanical Characteristics:
* Case: Epoxy, Molded * Weight: 1.1 Gram (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead and Mounting Surface Temperature for Soldering Purposes: * *
220C Max. for 10 Seconds, 1/16 from Case Polarity: Cathode indicated by Polarity Band ESD Protection: Human Body Model > 4000 V (Class 3) Machine Model > 400 V (Class C) Leads are Readily Solderable
AXIAL LEAD CASE 267-05 (DO-201AD) STYLE 1
MARKING DIAGRAM
80SQ 045N YYWW G G Unit V YY = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current TL = 75C (PsiJL = 12C/W, P.C. Board Mounting, Note 2) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating and Storage Junction Temperature Range (Reverse Voltage Applied) Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IO IFSM Max 45
8.0 140
A A
ORDERING INFORMATION
Device Package Axial Lead* Axial Lead* Axial Lead* Axial Lead* Shipping 500 Units/Box 500 Units/Box 1500/Tape & Reel 1500/Tape & Reel
TJ, Tstg dv/dt
-65 to +125 10
C V/ns
80SQ045N 80SQ045NG 80SQ045NRL 80SQ045NRLG
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
Preferred devices are recommended choices for future use and best overall value.
1
May, 2006 - Rev. 3
Publication Order Number: 80SQ045N/D
80SQ045N
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Lead (See Note 2 - Mounting Data) Thermal Resistance, Junction-to-Ambient (See Note 2 - Mounting Data) Symbol RqJL RqJA 0.9 in x 0.9 in Copper Pad Size 13 50 6.75 in x 6.75 in Copper Pad Size 12 40 Unit C/W
ELECTRICAL CHARACTERISTICS (TL = 25C unless otherwise noted)
Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 8.0 A, TL = 25C) Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 1) TL = 25C TL = 100C 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2.0%. Symbol vF 0.55 iR 1.0 50 mA Max Unit V
30 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
30 10
100C 1 125C 75C
MBR845 1 100C 125C 25C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.8 75C
0.1
25C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.8
0.1
Figure 1. Typical Forward Voltage
IR, INSTANTANEOUS REVERSE CURRENT (AMPS)
Figure 2. Maximum Forward Voltage
1E-01 125C 100C 75C
10,000
C, CAPACITANCE (pF)
1E-02
1E-03
f = 1 MHz TJ = 25C 1000
1E-04 25C
1E-05 1E-06
100 0 5 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS) 45 50 0.1 1 10 VR, REVERSE VOLTAGE (VOLTS) 100
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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80SQ045N
75 70 COPPER AREA (sq in) 65 60 55 50 See Note 2 45 40 35 30 0 2 4 6 8 10 RqJA (C/W) IF, AVERAGE FORWARD CURRENT (AMPS) 9 8 dc 7 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 TL, LEAD TEMPERATURE (C) SQUARE WAVE RqJL = 12C/W
Figure 5. RqJA versus Copper Area
Figure 6. Current Derating - Lead
4.5
NOTE 2 -- MOUNTING DATA
4 PFO, AVERAGE POWER DISSIPATION (WATTS) 3.5 3 2.5 2 1.5 1 0.5 0 0 2 4 6 8 10 IO, AVERAGE FORWARD CURRENT (AMPS) dc SQUARE WAVE TJ = 125C
Mounting Method
P.C. Board with 6.75 sq. in. copper surface.
Figure 7. Forward Power Dissipation
r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE
1
D = 0.5 0.2
0.1
0.1 0.05 0.01 P(pk) Copper Area = 0.271 sq. in. RqJA = 61.8 C/W t2 DUTY CYCLE, D = t1/t2 10 100 1000 t1
0.01 SINGLE PULSE 0.0001 0.001 0.01
0.001
0.1 t, TIME (sec)
Figure 8. Thermal Response, Junction-to-Ambient
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3
EE EE EE EE EE EE EE EE
1.0
L = 3/8,
Board Ground Plane
80SQ045N
PACKAGE DIMENSIONS
AXIAL LEAD CASE 267-05 ISSUE G
K D
1
A
2
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B D K INCHES MIN MAX 0.287 0.374 0.189 0.209 0.047 0.051 1.000 --- MILLIMETERS MIN MAX 7.30 9.50 4.80 5.30 1.20 1.30 25.40 ---
B
K
STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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4
80SQ045N/D

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